Used wire bonders for sale & wanted
Kaijo FB 118CH hybrid ball
bonder, excellent condition, for sale
Kulicke & Soffa K&S
961 film wafer mount taper for 8" wafers,
slightly used, from an engineering lab.
FK 6320,
FK Delvotec
6520 wire bonders,
FK
Delvotec 4200 die bonders
ASM AD8930V
LED Die Bonder For Sale, high speed epoxy die bonder
for vertical LED application,
K&S 8060 Wedge Bonder X 10 sets for sale, fine pitch capability:
< 55µm,
bonding area: 63.5 x 63.5 mm, bonding wire: Au/Al/Cu = 0.7 to
2.0 mils
(18 to 76.2 um), currently set up for Al wire
Hitachi CM-200 die bonder vintage 2004, excellent condition
Orthodyne Electronics 360C-HD 360, aluminum wire bonders,
K&S
4123
WEDGE BONDER, K&S 4124 BALL
BONDER,
WANTED
ROYCE 552 Multi function pull tester with 50g RPTM (rotary
pull test module),
MP-6 high force X Y manipulator w/ vacuum hold down & Leica GZ-6
microscope
ESEC 3018 wire bonder for sale, pictures available
K&S 8060 gold wire bonder
Unit regularly bonded with 0.8 mil wire to a 60um pitch pad with
high yield on a 417 pad CPU device with both organic and ceramic
substrates.
Tool was used in an engineering prototype
lab for first silicon
device evaluation builds (typically 50-200 units per build). It
has never been
used for production volumes.
SOLD
Applications: Die bonding of semiconductor chips on dispensed,
stamped or off-line
screen printed epoxy adhesive. Average cycle
time 1.8sec. per die excluding eject
and bond time.
Vision system edge and pattern recognition with 256 resolution.
K&S 1484, K&S 4523, KnS 8020,
Kaijo FB-118A sold, KNS 1488plus,
Kyushu
Matsushita DM60M-H, NEC Machinery CPS100, Shinkawa UTC-470, KNS 8020
CONTACT
via email:
Sales@national-ate.com
NATIONAL A.T.E.
Buys, Sells, &
Brokers used and
pre-owned, semiconductor testers, IC test systems, semiconductor
production equipment, microscopes, wafer probe inspection,
pre-owned SMT, surplus thermal forcing systems, and In-Circuit
test systems ICT. Also offering consignment of customer
owned used and surplus equipment.
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