ASM AD8930V LED Die Bonder For Sale, high speed epoxy
die bonder for vertical LED application, asking $100K each.

• XY placement accuracy: ±38 µm @ 3 sigma
• Precision bonding motion with fine resolution at
• X: 0.625 µm and Y: 0.5 µm
• Precise epoxy stamping capability with pre-bond
• Inspection
• Flexible to handle different vertical leadframes
• (maximum height: 72 mm)
• Rotary input track and multi-magazine output
• Elevated material handling
• Suitable for multi-die bonding applications
• Multi-magazine input elevator (optional)
• Automatic die θ alignment at wafer stage
• PR look ahead capability
• Advanced defect inspection at wafer stage
• Applications include vertical LED, photo transistor
• and infrared diodes



Solutions for Surplus Semiconductor Equipment disposal.


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